PCB Raw Material
| Item | Standard | Advanced |
| FR4 Standard Tg | Shengyi, ITEQ, KB, Nanya | Shengyi, ITEQ, KB, Nanya |
| FR4 Mid Tg (Lead Free Compatible) | Shengyi S1000, ITEQ IT158 | Shengyi S1000, ITEQ IT158 |
| FR4 High Tg (Lead Free Compatible) | Shengyi S1000‐2, S1170 EMC EM827 Isola 370HR ITEQ IT180A Panasonic R1755V | Shengyi S1000‐2, S1170 EMC EM827 Isola 370HR ITEQ IT180A Panasonic R1755V |
| High Performance Low Loss FR4 | EMC EM828, EM888(S), EM888(K) Isola FR408, FR408HR Isola I‐Speed, I‐Tera MT Nelco N4000‐13EP, EPSI Panasonic R5775 Megtron 6 | EMC EM828, EM888(S), EM888(K) Isola FR408, FR408HR Isola I‐Speed, I‐Tera MT Nelco N4000‐13EP, EPSI Panasonic R5775 Megtron 6 |
| RF Materials | Rogers RO4350, RO3010,RO6003, Taconic RF‐30, RF‐35,TLC, TLX, TLY Taconic 601, 602, 603, 605 | Rogers RO4350, RO3010 Taconic RF‐30, RF‐35, TLC, TLX, TLY Taconic 601, 602, 603, 605 |
| Halogen Free | EMC EM-285, EM370(D) Panasonic R1566 | EMC EM-285, EM370(D) Panasonic R1566 |
| Aluminum Backed PCB | Shengyi SAR20, Yugu YGA | Shengyi SAR20, Yugu YGA |
Special Materials
| Rigid Polyimide: Shengyi SH260, Ventec VT901 |
| BT Epoxy: Nelco and Mitsubishi |
| High CTI FR4(CTI>600): Shengyi S1600 |
| Flexible Circuit Materials: Dupont, Panasonic, Taiflex, Shengyi |
Surface Finishes
| Electroless Nickel Immersion Gold (ENIG): meet IPC-4552 |
| Hot Air Solder Level (HASL, Lead and Lead‐free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
PCB Technology Overview
| Item | Standard | Advanced |
| Rigid‐Flex & Flexible Circuits | Y | Y |
| Buried and Blind Vias | Y | Y |
| Sequential Lamination | Y | Y |
| Single ended impedance | 50 – 90 ohms +/- 8% but no less than 4 ohm | 50 – 90 ohms +/- 5% but no less than 4 ohm |
| Differential impedance | 100 – 155 ohms +/- 10% | 100 – 155 ohms +/- 10% |
| Coplanar waveguide impedance | 50-90ohms: +/-5 ohm | 50-90 ohms: +/-5% |
| Hybrids & Mixed Dielectrics | Y | Y |
| Aluminum or Copper based PCB’s | Y | Y |
| Non‐Conductive Via Fill (VIP) | Y | Y |
| Conductive Via Fill | Y | Y |
| Cavity Boards | Y | Y |
| Back drilling | Y | Y |
| Controlled Depth Drill and Rout | Y | Y |
| Edge Plating | Y | Y |
| Buried Capacitance | Y | Y |
| Etch Back | Y | Y |
| In‐board Beveling | Y | Y |
| 2‐D Bar Code Printing | Y | Y |
| Maximum Layer Count | 20 | 36 |
| Maximum Panel Size | 533x610mm [21×24″] | 610x1067mm [24×42″] |
| Outer Layer Trace/Spacing (1/3oz starting foil + platig) | 90µm/90µm [0.0035″/0.0035″] | 64µm/76µm [0.0025″/0.003″] |
| Inner Layer Trace/Spacing (Hoz inner layer cu) | 76µm/76µm [0.003″/0.003″] | 50µm/50µm [0.002″/0.002″ |
| Maximum PCB Thickness | 3.2mm [0.125″] | 6.5mm [0.256″] |
| Minimum PCB Thickness | 0.20mm [0.008″] | 0.10mm [0.004″] |
| Minimum Mechancial Drill Size | 0.20mm [0.008″] | 0.10mm [0.004″] |
| Minimum Laser Drill Size | 0.10mm [0.004″] | 0.10mm [0.004″] |
| Maximum PCB Aspect Ratio | 10:1 | 25:1 |
| Maximum Copper Weight | 5 oz [178µm] | 6 oz [214µm] |
| Minimum Copper Weight | 1/3 oz [12µm] | 1/4 oz [9µm] |
| Minimum Core Thickness | 50µm [0.002″] | 38µm [0.0015″] |
| Minimum Dielectric Thickness | 64µm [0.0025″] | 38µm [0.0015″] |
| Minimum Pad Size Over Drill | 0.46mm [0.018″] | 0.4mm [0.016″] |
| Solder Mask Registration | ± 50µm [0.002″] | ± 38µm [0.0015″] |
| Minimum Solder Mask Dam | 76µm [0.003″] | 64µm [0.0025″] |
| Copper Feature to Edge, V‐cut (30°) | 0.40mm [0.016″] | 0.36mm [0.014″] |
| Copper Feature to PCB Edge, Routed | Copper Feature to PCB Edge, Routed0.25mm [0.010″] | 0.20mm [0.008″] |
| Tolerance on Overall Dimensions | +/-100µm [0.004″] | +/-50µm [0.002″] |
| Copper coin embedded | Y (material:Red copper) | Y (material:Red copper) |
Advanced Processes
| Direct Imaging for Innerlayers, Outerlayers, and Soldermask |
| Direct Imaging for Innerlayers, Outerlayers, and Soldermask |
| Direct Plating for High Layer Count and Microvias Products |
| Reverse Pulse Plating |
| Solid Copper Plated PTH Vias |
| XACT Tooling System for Improved Layer‐to‐Layer Registration |
| Spray Coating for Soldermask |
| Inkjet Printing for Legend |
| In‐Line AOI for Outerlayers and AOI for Final Inspection |
| ZETA® Material for HDI and Low‐Loss Applications |
| ORMET® Copper Paste for Any‐layer Connections |
Quality System and Certifications
| IPC Specs: IPC‐A‐600, IPC‐6012, IPC‐6013, IPC‐6016 (Class II and Class III). |
| Quality System Certifications: ISO 9001:2015, TS16949:2016, ISO13485: 2016 |
| Environmental Certifications: ISO14001:2014, ISO/TS14067:2013 |
| UL Certificated |
