Normally,all PCB base material used by Weller conform to IPC4101( specification for base materials for rigid and multilayer printed boards ) and UL certificated.
The table below is an extract of certain characteristics from IPC-4101 classifications, highlighting some of the details already referenced.
| IPC-4101 | 99 | 101 | 121 | 124 | 126 | 127 | 128 | 129 | 130 |
| Tg (min) C | 150 | 110 | 110 | 150 | 170 | 110 | 150 | 170 | 170 |
| Td (min) C | 325 | 310 | 310 | 325 | 340 | 310 | 325 | 340 | 340 |
| CTE Z 50-260 C | 3,5% | 4% | 4% | 3,50% | 3% | 4% | 3,50% | 3,50% | 3% |
| T260 (min) minutes | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| T288 (min) minutes | 5 | 5 | 5 | 5 | 15 | 5 | 5 | 15 | 15 |
| Fillers > 5% | Yes | Yes | NA | NA | Yes | Yes | Yes | NA | Yes |
| Dk/Permittivity (max) | 5,4 | 5,4 | 5,4 | 5,4 | 5,4 | 5,4 | 5,4 | 5,4 | 5,4 |
If you have experience of a material which you know works for your product, you can send it to us as a reference.
Some key material characteristics
- CTE – Z axis(Co-efficient of thermal expansion): This is a measure of how much the base material will expand when heated. Measured as PPM/degree C (both before and after Tg) and also in % over a temperature range. Typical Low CTE High Tg PCB Material EM-827 827B
- Td (Decomposition temperature): This is the temperature at which material weight changes by 5%. This parameter determines the thermal survivability of the material.
- Tg (Glass transition temperature): The temperature at which the material stops acting like a rigid material and begins to behave like a plastic / softer.
- T260 (Time to delamination): This is the time it take for the base material to delaminate when subjected to a temperature of 260 degrees C.
- T288 (Time to delamination): This is the time it take for the base material to delaminate when subjected to a temperature of 288 degrees C.
- Dk (Dielectric constant): The ratio of the capacitance using that material as a dielectric, compared to a similar capacitor which has a vacuum as its dielectric.
- CTI (Comparative tracking Index): A measure of the electrical breakdown properties of an insulating material. It is used for electrical safety assessment of electrical apparatus. The normal CTI material as High CTI CEM-3 equivalent to FR-4.0: S2126, High thermal resistance: High CTI S3116.
Our Standard PCB Laminate Material Source
| Standard | Advanced | Flex | IMS |
| Sheng Yi S1140 Tg 140 S1141 150 Tg 150 S1000H Tg 155 S1000-2 Tg 180 S1000-2M Low CTE,High Thermal Resistance S1600 high CTI>600 S1150G halogen free | Rogers Ro4350B Tg>280 Ro4003C Tg>280 TMM3,TMM4 Tg>280 MM6 TMM10 Tg>280 MM10i TMM13i Tg>280 RT/duroid® 600 Tg>280 | Tai Flex Taiflex_datasheet Shengyi SF202 Shengyi SF302 | Bergquist MP-0653 Berguist-Series |
| ITEQ IT-158 Tg150 IT-180A Tg180 | Taconic TLC Tg>180 TLE Tg>180 TLT Tg>180 TLX Tg>180 | DuPont PYRALUX AC(Polyimide) PYRALUX AP(Polyimide) FR7001,coverlay | ShengYi SAR15 1.5W |
| Kingboard KB-6160 Tg130 KB-6165 Tg150 KB-6167 Tg170 KB-6160F (CTI-175V Low CTE UV-Blocking) KB-6160 CTI-175V UV Blocking KB-6160A CTI-175V UV-Blocking KB-6160C CTI≥600V | Isola FR406,FR408 370HR,IS410 | Thin Flex A-2005ED Polyimide W-0505ED polyimide | ITEQ IT-859GTA |
| TUC Taiwan TU-872 lk Tg220 | |||
| Nelco Nelco4000-29 N4000-6 Nelco4000-13 | |||
| NanYa NP-140TL, NP-150TL NP-170TL,NP-180TL | |||
| Panasonic R-5575-R5470 R1706_R-1755D |
More information on PCB Laminates, visit the following websites.
| Supplier Name | Web Link |
| SHENG YI | www.syst.com.cn |
| ROGERS | www.rogerscorp.com |
| ISOLA | www.isola-group.com |
| ITEQ | www.iteq.com.tw |
| TACONIC | www.taconic-add.com |
| NAN YA | www.npc.com.tw |
| DUPONT | www.dupont.com |
| NELCO | www.parkelectro.com |
| TAIFLEX | www.taiflex.com |