Flex PCB Manufacturing Capability
| Item | Flex PCB Capability |
| PCB Layer Count | 1~6Layers |
| Flexible Circuit Materials: | Dupont, Panasonic, Taiflex, Shengyi |
Min. Line Width/Space | 18um(finish Cu): 3.5/3.5mil 35um(finish Cu): 4.0/4.40mil |
| Min Space Between Coverlay Opening | 0.2mm |
| Edge of Coverlay Opening to Trace | 0.20mm(preferred) |
| Min Space between coverlay and solder pad | 0.15mm |
| Polyimide Films | 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ) |
| Thermabond Adhesive | Thermosetting Adhesive, 3M high adhesion tape |
| Copper Foils (RA or ED) | 1/3oz, 1/2oz, 1oz |
| Flex Circuit Stiffeners | Polyimide, Rigid FR4, metal |
| Solder Resist | Coverlay, LPI |
| Min. Finished Hole size | 0.2mm |
| Max. Finished Hole size | 6.30mm |
| Hole tolerance | ±0.05mm |
| Min.space between holes | 0.15mm |
| Minimum conductor edge to outline edge | ≥0.1mm |
| Minimum space between coverlay and conductor | Minimum space between coverlay and conductor |
| Hole to outline edge | ≥ 0.10mm |
Tooling tolerance | Knife(Soft) tooling ± 0.25mm Steel(Hard) tooling ± 0.05mm CNC drill/rout ± 0.10mm |
| Maximum Layer to Layer Mis-registration | ± 0.10mm |
| Copper Plated Thickness (PTH only) | 8~15um;20~30um;30~70um(special) |
| Surface Finish | Immersion Gold, Plating Hard Gold, OSP |