Rigid-flex PCB Capability
| Item | Technical Data |
| Layer Count | 2~16Layers |
| Min. Line Width/Space | 18um(finish Cu): 3.5/3.5mil 35um(finish Cu): 4.0/4.0mil |
| Min Space Between Coverlay Opening | 0.2mm |
| Edge of Coverlay Opening to Trace | 0.20mm(preferred) |
| Min Space between coverlay and solder pad | 0.15mm |
| Polyimide Films | 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ), 5 mils(125µ) as custmer requested |
| Thermabond Adhesive | Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
| Copper Foils (RA or ED) | 1/4oz to 3oz |
| FR-4 in Multi-layer Flex Circuits | Laminated to flex circuit to create rigid flex boards, typically with vias |
| Stiffeners | Polyimide, Rigid FR4, PSA, metal, or customer requested |
| Solder Resist | Coverlay, LPI |
| Min. Finished Hole size | 0.20mm |
| Max. Finished Hole size | 6.30mm |
| Hole tolerance | ±0.05mm |
| Min.space between holes | 0.15mm |
| Minimum conductor edge to outline edge | ≥ 0.10mm |
Tooling tolerance | Knife(Soft) tooling ± 0.25mm Steel(Hard) tooling ± 0.05mm CNC drill/rout ± 0.10mm |
| Maximum Layer to Layer Mis-registration | ± 0.10mm |
| Copper Plated Thickness (PTH only) | 8~15um;20~30um;30~70um(special) |
| PCB Surface Finish | Immersion Gold, HASL, Lead free HASL, Plating Hard Gold, OSP How to choose PCB surface treatment process |