IOT Devices PCB Assembly-Embedded Hardware

Description

PCB specification PCB Layer: 8L PCB base materials: FR4-Tg170(S1000-2) Copper thickness: 1OZ Surface finishing: HAL lead free Solder mask color: Green Silkscreen: White Taiyo,PSR4000 Note: RoHS Compliance HDI with 2+6+2 Complex Mixed impedance control Assemlby specifiation Solder paste: Alpha:OM-340 Mixed assembly: DIP+SMT Confirmal Coating: Yes-DCA200H Electronical functional test: Yes Assembly standard: IPC-A-610E Package: ESD bag