HDI-(High Density Interconnected) PCBs are manufactured with several prominent features. These PCBs have higher circuitry density, higher connection pad density, and finer traces and gaps. Additionally, these PCBs are characterized by their smaller vias and capture pads, blind/buried vias, and through vias from surface to surface.
HDI PCBs are largely chosen for enhancing the electrical performance of the device, and are finding their way into many applications including military communication devices, aerospace, computers, smartphones, and medical equipment, among several others.
Being a leading HDI PCB manufacturer, we at Weller Technology offer precision designed boards for use in high density applications. We have high tech capabilities and the right people to design advanced circuit boards to the exact customer’s specifications.
HDI PCB Technical Details
You can customize your HDI PCBs utilizing the best options from the list below.
| HDI PCB Features | Prototype | Mass Production |
| Base Material | FR4, Halogen Free, RCC, Ulta Thin Core,RF | FR4, Halogen Free, RCC, Ulta Thin Core |
| Surface Treatment | ENIG+OSP, ENIG, Carbon+OSP, Immersion Tin, OSP | ENIG+OSP, ENIG, Carbon+OSP, Immersion Tin, OSP |
| Min. Line/Spacing | 2.0/2.0mil | 3.0/3.0mil |
| Critical Line Width Tolerance | 2.5mil±15% | 2.0mil±10% |
| Min.Microvia Drill Size (Laser) | 4.0 mil | 4.0 mil |
| Min.Capture/Target Pad Size | 10.0 mil | 10.0 mil |
| Min PTH & Buried Drill Bit | 0.20 mm | 0.20 mm |
| Min. Annular Ring | 3.5mil | 3.0mil |
| Max. PTH Aspect Ratio | 10:1 | 12:1 |
| Max. Microvia Aspect Ratio | 0.8:1 | 0.8:1 |
| Single ended impedance | 50 – 90 ohms: +/- 8% (but no less than 4 ohm) | 50 – 90 ohms: +/- 8% (but no less than 4 ohm) |
| Differential impedance | 100 – 155 ohms: +/- 10% | 100 – 155 ohms: +/- 10% |
| Solder Mask Clearance | 1.5 mil | 1.5 mil |
| Solder Mask Web | 2.5 mil | 2.5 mil |
| Min. BGA/CSP pitch | 0.4 mm | 0.4 mm |
| Registration from Layer to Layer | 2.0 mil | 2.0 mil |
| Min. dielectric thickness | 1.8 mil | 2.0 mil |
| PTH Hole Tolerance | +/- 2mil | +/- 3mil |
| Min. Outline Tolerance | ±0.1mm | ±0.1mm |
| Min. Core Thickness | 3.0 mil | 3.0 mil |
| Hole Structure | Stagger Vias, Stacked Via, Skip Via, Stepped Via, ELIC | Stagger Vias, Stacked Via, Skip Via, Stepped Via, ELIC |
| Other Technology | Carbon Jumper, LDI, DLD, Copper Filled Via, VOP | Carbon Jumper, LDI, DLD, Copper Filled Via, VOP |
HDI PCBs are widely chosen for applications that call for compact, yet higher functional boards. These boards help minimize the size of the application, and enhances their electrical performance and lowers power consumption. Also, they ensure stable voltage rail, minimal stubs, and lower RFI/EMI. Since, we employ quality systems such as ISO 9001 to develop well-defined PCBs, our customers can rest assured with the quality of the final PCB assembly.
With us, you will find dedicated sales and technical support teams who dedicatedly meet ever-increasing customer demand for low cost, and high-quality PCBs.
Any question,please send your concerning to [email protected],and we will response within 4 hours.