Any other RF substrate like taconics, etc. that we can use to fill copper inton via hole?
Sorry taconics material is not OK as it is a soft feature material which can be randomly “expanded” by filled copper.
Sorry taconics material is not OK as it is a soft feature material which can be randomly “expanded” by filled copper.
Sorry, we cannot do via filled to Rogers material, as Rogers material is too fragile, which is easy to be expanded to be “broken” by filling copper; 5mm metal back plate is ok
Yes,but the PCB final thickness (Rogers4350+copper plate base less than 6.0mm),you can visit “PCB embedded copper coin” for more details.
We can do via fillings as: solder mask plugging; resin plugging, copper filling to via holes (Cu filled), Cearance is 8mil.
Yes,we can,but need two pcs of 2L RO4350 core stacked each other together (Or 2L RO4350+2L FR4),minimum PCB thickness: 0.80mm.For illustration,please visit:RO4350 PCB with Cu coin embedded
PCB copper coin embedded is a perfect option to transmit the heat of the circuit board,but limited manufacturing capaiblity as below: Copper coin thickness: 0.8mm(min), 3.0mm(max), can not be more thicker than 3.0mm. Copper coin size: 3.0mm X 3.0mm (min), 400.00 X 300.00mm(max); Spacing copper coin to holes: 1.0mm; Spacing copper coin to track: 1.0mm(min).
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