Not all PCB manufacturers can make good quality PCB boards for you.A good production environment plus advanced equipment is a premise of good PCB circuit board manufacturing. Weler have learned “5s” for our management system since 2003 and contentiously equipped multi-automatic manufacturing equipment to meet capable of manufacturing high quality and high technology PCB fabrication.
HDI-(High Density Interconnected) PCBs are manufactured with several prominent features. These PCBs have higher circuitry density, higher connection pad density, and finer traces and gaps. Additionally, these PCBs are characterized by their smaller vias and capture pads, blind/buried vias, and through vias from surface to surface. HDI PCBs are largely chosen for enhancing the electrical … Continued
Rigid-flex PCB Capability Item Technical Data Layer Count 2~16Layers Min. Line Width/Space 18um(finish Cu): 3.5/3.5mil35um(finish Cu): 4.0/4.0mil Min Space Between Coverlay Opening 0.2mm Edge of Coverlay Opening to Trace 0.20mm(preferred) Min Space between coverlay and solder pad 0.15mm Polyimide Films 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ), 5 mils(125µ) … Continued
Flex PCB Manufacturing Capability Item Flex PCB Capability PCB Layer Count 1~6Layers Flexible Circuit Materials: Dupont, Panasonic, Taiflex, Shengyi Min. Line Width/Space 18um(finish Cu): 3.5/3.5mil35um(finish Cu): 4.0/4.40mil Min Space Between Coverlay Opening 0.2mm Edge of Coverlay Opening to Trace 0.20mm(preferred) Min Space between coverlay and solder pad 0.15mm Polyimide Films 0.5 mil (12.5µ), 1 mil … Continued
PCB Raw Material Item Standard Advanced FR4 Standard Tg Shengyi, ITEQ, KB, Nanya Shengyi, ITEQ, KB, Nanya FR4 Mid Tg (Lead Free Compatible) Shengyi S1000, ITEQ IT158 Shengyi S1000, ITEQ IT158 FR4 High Tg (Lead Free Compatible) Shengyi S1000‐2, S1170 EMC EM827 Isola 370HR ITEQ IT180A Panasonic R1755V Shengyi S1000‐2, S1170 EMC EM827 Isola 370HR … Continued
Applications:
Used for static charge dispelling in communications, electronic and microelectronic
manufacturing/assembly industries.Recommend distance (To working surface): 12～36 in。
